[Analysis Case] Simultaneous Heating Analysis of Copper Plates and Solder by TDS
It is possible to evaluate degassing in an environment close to the actual process by bringing the materials into contact with each other.
Soldering of metals is one of the essential processes in the field of electronics. It is known that the outgassing that occurs when metal and solder are heated in contact can lead to voids. Below, we introduce a case where TDS analysis (Thermal Desorption Spectroscopy) was performed with solder placed on a copper plate. TDS can evaluate the outgassing associated with the heating of materials. By bringing the copper plate and solder into contact and heating them simultaneously within the TDS apparatus, we were able to capture outgassing in an environment close to the actual process.
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For detailed data, please refer to the catalog.
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Analysis of electronic components, manufacturing equipment, and parts.
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Download All Catalogs![[Analysis Case] Simultaneous Heating Analysis of Copper Plate and Solder by TDS_C0569](https://image.mono.ipros.com/public/catalog/image/01/3a8/473654/IPROS44967888722508109851.jpeg?w=120&h=170)
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MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!
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