Laser microfabrication: Fine hole processing of SUS304 using ultrashort pulse laser.
Material: SUS304 / Thickness: 0.1mm / Hole pitch: 100μm A through hole with a diameter of 20μm was processed in a stainless steel flat plate using a super short pulse laser. Processing is possible not only on flat surfaces but also on curved surfaces.
Inquire About This Product
basic information
Material: SUS304 / Thickness: 0.1mm / Hole Pitch: 100μm A through hole with a diameter of 20μm was processed in a stainless steel flat plate using a super short pulse laser. Processing is possible not only on flat surfaces but also on curved surfaces.
Price range
Delivery Time
Applications/Examples of results
Material: SUS304 / Thickness: 0.1mm / Hole pitch: 100μm
catalog（4）
Download All Catalogs
Company information
At "HIKARI LASER LAB.", we offer services for precision processing using ultra-short pulse lasers, including "contract processing," "development agency," and "marking." Precision processing and surface modification/internal marking using picosecond and femtosecond lasers are utilized in various industrial equipment across sectors such as the medical industry, automotive industry, and semiconductor industry. Recently, there has been a demand for surface modification not only for shape processing like fine hole drilling, cutting, trimming, and groove processing but also for enhancing functionalities such as water repellency, release properties, friction reduction, and improved sliding properties. Additionally, there is a demand for marking inside glass from the medical industry. Laser processing is possible on a wide range of materials, including transparent materials like glass and diamonds, difficult-to-cut materials like titanium, and resins, CFRP, ceramics, and polyimides. Regarding surface modification, we have received requests to improve the release properties of molds. We will continue to "challenge" ourselves in precision processing and surface modification using ultra-short pulse lasers to meet our customers' needs!