[Examples of Using Mmems Substrates] High Thermal Dissipation Substrate for High Brightness LEDs
A tall copper electrode can be created! The volume of the body has increased, allowing it to handle large currents.
As an example of the use of the "M-MEMS substrate," we would like to introduce the "High Heat Dissipation Substrate for High Brightness LEDs." The LED heat dissipation characteristics are significantly improved by the "M-MEMS substrate." It is possible to reduce the temperature rise by 10 to 40°C compared to conventional methods. Additionally, it can be formed on aluminum nitride, achieving an electrode thickness that allows for high thermal diffusion of 50 to 140 μm. We can also accommodate the special mounting needs of LEDs, so please feel free to consult with us. 【Features】 ■ Capable of handling large currents ■ Can be formed on aluminum nitride with excellent heat dissipation ■ Achievable electrode thickness that allows for high thermal diffusion (50 to 140 μm) ■ Achievable electrode gap that can accommodate narrow pitch LEDs (below 100 μm) ■ Capable of various prototypes, including special electrode structures *For more details, please refer to the PDF materials or feel free to contact us.
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Our company primarily specializes in surface treatment through ultra-precision plating. Among our offerings, the lens molds, ultra-thick films, and electroless nickel plating "Hainop" have a proven track record of over 20 years. Additionally, by applying appropriate pre-treatment, we can achieve thick plating on difficult-to-plate materials such as carbide, titanium, glass, and ceramics while maintaining adhesion that withstands processing. We welcome inquiries such as, "Can you plate on such base materials?" Please feel free to contact us.