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  6. Thinning and distortion-free technology

Thinning and distortion-free technology

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last updated:Sep 25, 2019

日本エクシード
日本エクシード
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Leave the thinning of wafers to Japan Exceed!!

Processing results - Si 4 inches 25um~ - Si 6 inches 50um~ - GaAs 3 inches 20um~ - LT (Lithium Tantalate) 2 inches 25um~

    Circuit board design and manufacturingothers
6インチ50μm.jpg

Thinning and distortion-free technology

6インチ50μm.jpg
6インチ50μm.jpg

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After thinning, it is also possible to attach it to a support substrate (such as quartz or sapphire) for easier handling by the customer.

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日本エクシード

日本エクシード

Electronic Components and Semiconductors

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EXCEED has the meaning of surpassing everything. Our company name, which carries that meaning, reflects our attitude and commitment to our work. We are constantly exploring polishing techniques that exceed limits and aspire to master the world of polishing. More flat, more smooth, more thin, more beautiful. New possibilities arise from polishing techniques that transcend various fields, as well as from our accumulated experience.

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