Supports processing materials such as Si wafers! We meet various polishing needs for different materials.
Nihon Exceed conducts special processing of Si using thinning processing technology and high-purity technology. We can also handle Si wafers, SOI wafers, and other single-crystal and polycrystalline silicon component materials (such as electrodes for dry etching equipment and focus rings). Our company meets various polishing needs for processing materials. 【Special Si Processing】 ■ Thinning Processing Technology ■ Small Diameter High-Precision Processing Technology ■ High-Purity Technology *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Si Wafer】 ■Supported Sizes ・Φ12.5mm to Φ200mm, 3mm×3mm to 156mm×156mm *Rectangular shapes are also supported ■Thickness: 25μm and above ■TTV: Less than 1μm ■Particles: 20 or fewer particles of 0.2μm ■Surface Roughness: Less than 0.3nm ■Film Thickness Control is possible *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Download All Catalogs![[Technical Introduction] Si Special Processing](https://image.mono.ipros.com/public/catalog/image/01/6bd/481416/IPROS26365299614822743965.jpeg?w=120&h=170)
Company information
EXCEED has the meaning of surpassing everything. Our company name, which carries that meaning, reflects our attitude and commitment to our work. We are constantly exploring polishing techniques that exceed limits and aspire to master the world of polishing. More flat, more smooth, more thin, more beautiful. New possibilities arise from polishing techniques that transcend various fields, as well as from our accumulated experience.
![Micron-level precision, high difficulty × short delivery time! Precision cutting processing [Processing case examples available].](https://image.mono.ipros.com/public/product/image/2070746/IPROS9035842601074547405.png?w=280&h=280)