Polishing processes are available in various sizes and thicknesses.
Regarding SOI wafers, the transition to larger diameters (12"φ) is steadily progressing, and currently, the latest technologies that cannot be achieved with smaller diameters are being developed with these materials. However, the subsequent processes (device processes) are limited to smaller diameters (8"φ or less), which means that the latest technologies available in large-diameter materials cannot be utilized. Japan Exceed is constantly striving to improve technology to meet these needs and has established a production system based on mass production. Additionally, size reduction of SOI wafers is also possible. 【Processing Details】 ■ Material Names: Various diameter Si wafers, SOI wafers, single crystal and polycrystalline silicon component materials (electrodes for dry etching equipment, focus rings, etc.) ■ Compatible Sizes - Φ12.5mm to Φ200mm - 3mm×3mm to 156mm×156mm - Rectangular shapes are also supported - Finished Thickness: 25μm and above - Flatness: TTV 1μm or less - Particles: 20 or fewer at 0.2μm - Surface Roughness: 0.3nm or less - Film Thickness Control: Possible *For more details, please download the materials or contact us.
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basic information
SOI wafers, other single crystal and polycrystalline silicon component materials (electrodes for dry etching equipment, focus rings, etc.) are also available. If you have any requests, please feel free to contact us.
Price range
Delivery Time
※The delivery date may vary depending on the quantity, so please feel free to contact us.
Applications/Examples of results
For more details, please feel free to contact us.
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Company information
EXCEED has the meaning of surpassing everything. Our company name, which carries that meaning, reflects our attitude and commitment to our work. We are constantly exploring polishing techniques that exceed limits and aspire to master the world of polishing. More flat, more smooth, more thin, more beautiful. New possibilities arise from polishing techniques that transcend various fields, as well as from our accumulated experience.
