We propose suitable methods from both dry and wet processes! We will solve your challenges.
At Kyodo International, we offer "contract etching processing." We respond to various etching processing needs required for circuit formation, test pattern production, surface modification, and condition setting. We propose suitable methods from both dry (RIE, ICP) and wet processes to solve our customers' challenges. 【Features】 ■ Responding to various etching processing needs ■ Capable of accepting a series of processes from photolithography to etching to resist removal ■ Flexibly accommodating etching tests for different film types *For more details, please refer to the PDF document or feel free to contact us.
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【Materials with Processing Results】 <Dry Etching> ■RIE ・Si, SiO2, SiN, SiON, resin, Mo, W, Ti, Ta, TiN, etc. ■ICP ・Si, SiO2, etc. *For more details, please refer to the PDF document or feel free to contact us.
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**Main Processing Applications** <Dry Etching> ■ RIE - Pattern formation for masks, etc. - Etching grade verification for various materials - Resist stripping and ash processing (residue treatment) - Plasma resistance evaluation of materials (resins, ceramics, films, etc.) ■ ICP - Si molds for nanoimprint - Fine molds for resin injection molding - Mirror devices - Improvement of durability/optical properties - Plasma resistance evaluation of materials (resins, ceramics, films, etc.) - Black silicon <Wet Etching> ■ Metal etching (electrode wiring) *For more details, please refer to the PDF document or feel free to contact us.*
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A company that can respond instantly to the rapidly changing information society, that is Kyodo International. It has been 50 years since the company was founded. And a new challenge! We will face difficulties more strongly and boldly than ever. We look forward to your continued support.