Solving the 'want to do 〇〇' for implementation P version, reel parts, and semiconductor parts with X-ray inspection.
If you are having trouble with 'I want to inspect the BGA joints' or 'I want to inspect for soldering defects,' check out the examples now!
Utilizing new digital technology in the historically established field of X-ray imaging, we achieve realistic and easily understandable X-ray images. We solve your concerns regarding implementation P boards, reel components, and semiconductor parts through X-ray inspection, such as "I want to inspect the BGA joints," "I want to check for soldering abnormalities in resistors, capacitors, etc.," "I want to know about abnormalities in individual components," and "I want to check for wire bond disconnections, shorts, bends, etc." We have numerous case photos showcasing X-ray inspection in our catalog. ≪Proposals for Solving Your Concerns≫ ■ Void analysis software ■ Inspection software for mounted components ■ Inspection and counting software for reel components ■ Automatic inspection software for wire bonds *For more details, please refer to the PDF materials or feel free to contact us.
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【Usage】 ■Observation and Inspection ■Measurement and Analysis *For more details, please refer to the PDF document or feel free to contact us.
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Utilizing new digital technology in the historically established field of X-ray imaging, we achieve realistic and easily understandable X-ray images. BeamSense is developing a new X-ray fluoroscopy device with the concept of being compact, simple, and highly visible.