Defective inspections occurring within the IC can now be performed. Confirmation of the finish can be done for each manufacturing lot.
We would like to introduce a technology that applies "smart X-ray" imaging. Our company has developed a technology that diagnoses images of the interior of IC chips using X-ray imaging, allowing for the detection of defects such as wire bonding disconnections, shorts, and bends. By utilizing this technology, it becomes possible to conduct defect inspections occurring within the IC. 【Applicable Uses】 ■ Defect inspection of IC chips occurring in the process after wire bonding. ■ Re-inspection of lot-out products. ■ Confirmation of finishing for each manufacturing lot. *For more details, please refer to the PDF document or feel free to contact us.
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【Overview】 ■ By connecting the developed wire inspection software (WireInspection) and X-ray inspection software (BSFM), internal images of ICs are inspected. ■ Custom software development based on the inspection object and inspection specifications. * For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Utilizing new digital technology in the historically established field of X-ray imaging, we achieve realistic and easily understandable X-ray images. BeamSense is developing a new X-ray fluoroscopy device with the concept of being compact, simple, and highly visible.
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