Miniaturization of modules is possible! Semiconductor chips can be directly mounted on printed circuit boards using die bonding material!
We would like to introduce the COB process technology of Niigata Seimitsu Co., Ltd. The COB process can accommodate implementations such as a pad pitch of 0.07mm and a die size of □0.5mm. Additionally, we can comprehensively handle other processes related to the COB process, such as substrate cleaning, dicing, and pickup, all in-house. 【Features】 ■ Directly mounting semiconductor chips (ICs) onto printed circuit boards (PCBs) using die bonding material ■ A method of connecting the electrodes on the IC side to the electrodes on the PCB side using gold wire ■ Smaller mounting area compared to SMT methods, enabling miniaturization on the PCB ■ Implementation combined with SMT is also possible ■ Miniaturization of modules is achievable *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications】 ■ Pad pitch: 0.07mm pitch and above ■ Die size: 0.5mm and above ■ Molding: Liquid resin mold (printing method, dispensing method) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Niigata Seimitsu Co., Ltd. primarily develops SMS business and is engaged in the overall development design, manufacturing, and maintenance of electronic devices and more. We possess various implementation technologies, development/design technologies, and evaluation/analysis technologies, so please feel free to consult us if you have any requests.