Heat-dissipating substrate material "Cu-Diamond/Cu-W submount"

For laser diodes! A lineup of materials with various thermal expansion rates and thermal conductivities.

We handle the heat dissipation substrate material "Cu-Diamond/Cu-W Submount." Sharp edge processing and AuSn deposition are possible. We offer a lineup of materials with various thermal expansion coefficients and thermal conductivities. "W-10T" has achieved a high thermal conductivity Cu-W submount while maintaining low thermal expansion equivalent to conventional materials through our unique immersion technology. 【Features】 ■ High thermal conductivity ■ Cu-Diamond submount > 500 W/(m·K) ■ High thermal conductivity Cu-W submount realized (W-10T) ■ Lineup of materials with various thermal expansion coefficients and thermal conductivities ■ Sharp edge processing and AuSn deposition are possible *For more details, please refer to the PDF document or feel free to contact us.

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