For laser diodes! A lineup of materials with various thermal expansion rates and thermal conductivities.
We handle the heat dissipation substrate material "Cu-Diamond/Cu-W Submount." Sharp edge processing and AuSn deposition are possible. We offer a lineup of materials with various thermal expansion coefficients and thermal conductivities. "W-10T" has achieved a high thermal conductivity Cu-W submount while maintaining low thermal expansion equivalent to conventional materials through our unique immersion technology. 【Features】 ■ High thermal conductivity ■ Cu-Diamond submount > 500 W/(m·K) ■ High thermal conductivity Cu-W submount realized (W-10T) ■ Lineup of materials with various thermal expansion coefficients and thermal conductivities ■ Sharp edge processing and AuSn deposition are possible *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Lineup】 ■Cu-Diamond ・DC60 ・DC70 ■Cu-W ・W-6 ・W-10 ・W-10T ・W-20 *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Usage】 ■ For bar laser diodes *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Allied Material Co., Ltd. was established in 2000 through the merger of Tokyo Tungsten Co., Ltd. and Osaka Diamond Industrial Co., Ltd. Since then, we have steadily grown as a part of the Sumitomo Electric Group's industrial materials division, with the refining, material manufacturing, and processing technology of high melting point metal materials such as tungsten and molybdenum, as well as the manufacturing and precision processing technology of diamond precision tools as the two pillars of our business. We will continue to strive to create new added value based on our core technologies in order to survive alongside our customers in the rapidly changing market environment that is expected in the future, and we will continue to challenge ourselves to provide even higher satisfaction.