3D X-ray stereo method! The two-layer solder separation inspection of power devices has been realized!
The product has the capability to separately inspect the solder under the chip and the solder under the insulating substrate using the "X-ray stereo method." When using the X-ray transmission principle in the X-ray stereo method, the solder joint under the chip and the solder joint under the insulating substrate appear in the same position, causing the front and back to overlap, which prevents accurate inspection. The X-ray stereo method is a groundbreaking inspection device that allows for the separation and individual inspection of each solder joint. 【Features】 ■ High-output X-ray capable of penetrating a 5mm copper plate with 130kV, 0.5mA, and 39W (FX-500tRX) ■ Achieves high resolution with high output of 110kV, 0.2mA, 20W and spatial resolution of 2μm (FX-400tRX) ■ Enables two-layer separation inspection using 3D X-ray stereo method ■ Reduction in running costs due to the adoption of a long-life, 1.3 million pixel, 14-bit (16384 gradation) X-ray flat panel ■ Compact inspection machine body with traceability support through QR code recognition *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications (Excerpt)】 <FX-400tRX> ■X-ray tube type: Microfocus sealed source (sealed type) ■X-ray target position: Transmission type target (same method as open tube) ■X-ray tube voltage, tube current: 30-110kV, 200μA ■X-ray output: 16W ■X-ray focal spot diameter: 2μm <FX-500tRX> ■X-ray tube type: Microfocus sealed source (sealed type) ■X-ray target position: Reflection type target ■X-ray tube voltage, tube current: 30-130kV, 300μA ■X-ray output: 39W ■X-ray focal spot diameter: 5μm *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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