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  6. JTAG Boundary Scan Test System

JTAG Boundary Scan Test System

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last updated:Dec 27, 2021

サーテック フレキ基板(FPC)ソフトウェア ハードウェア 成膜加工 基板設計
サーテック フレキ基板(FPC)ソフトウェア ハードウェア 成膜加工 基板設計
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Streamlining debugging, implementation inspection, and defect analysis for boards equipped with BGA.

■ JTAG Boundary Scan Test - Debugging work efficiency is dramatically improved. - The area required for test pads can be reduced, allowing for miniaturization. - Electrical inspection and failure analysis of high-density mounted boards (with BGA) can be performed. ■ Benefits of Implementation - Inner layer signals of multilayer boards can be visualized. - The status of terminals on the backside of BGA can be visualized in real-time. - Terminals of FPGA and CPU can be manipulated freely. - There is no need to rewrite programs just to move I/O. - Physical contact with probes is not necessary. - Debugging can be done without software, so when problems occur, there is no need to verify whether the issue is with software or hardware. - Initial investments in fixtures and other equipment can be significantly reduced.

    Circuit board design and manufacturingContract manufacturingContract Analysis
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JTAG Boundary Scan Test System

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In recent years, globalization has progressed, and the demand for higher quality has increased from the high standards we have traditionally refined. There are concerns that if this continues, testing costs will become exorbitant. Previously, JTAG boundary scan, which was criticized for being difficult and inconvenient, has been simplified, and test libraries are now provided free of charge, leading to an increase in companies reconsidering its implementation. Flexible printed circuit boards, flexible boards, FPC, flex, rigid-flex High heat resistance, membrane switches, flexible printed circuit boards, flex, FPC, printed circuit boards Flexible printed circuit boards, flexible boards, FPC, flex, Hamamatsu City, Board design, boards, printed circuit boards, pattern design, assembly, SMD assembly, board analysis, circuit design, software, hardware, Electronic circuit design, rigid-flex, heat dissipation boards, Specialty boards, stretchable boards, transparent polyimide, polyimide MEMS, semiconductors, special materials, plating technology, wearables

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In-vehicle devices, industrial equipment, medical devices, wearable terminals, amusement, semiconductors, home appliances and AV equipment, optical devices, audio and video equipment, office automation equipment, information and communication devices, machine tools, etc.

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サーテック

サーテック フレキ基板(FPC)ソフトウェア ハードウェア 成膜加工 基板設計

Electronic Components and Semiconductors

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Sartec is a manufacturing support company based in Hamamatsu City, Shizuoka Prefecture, focused on flexible circuit board design. Going beyond our core strength and origin in "flexible circuit board design," we provide support tailored to each stage of development, from initial development to mass production, including software/hardware development, enclosure design, prototype evaluation, and manufacturing support. Printed circuit boards are an essential component often referred to as the "heart" of a product. Because we have a deep understanding of this core part, we can create a development process with minimal setbacks through our approach of "manufacturing that considers the user's experience" combined with "process design capabilities that encompass the entire product," turning the ideals of researchers and developers into tangible reality. At Sartec, we have a wide range of achievements across various fields, from cutting-edge special designs in medical and aerospace sectors to everyday products like automobiles and IoT appliances. We are also flexibly responding to the semiconductor field, which has been gaining attention in recent years, expanding the possibilities of technology through processes like film formation. If you have a desire to challenge conventional industry norms and pursue products or new technologies that do not yet exist in the world, please feel free to consult with Sartec.

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