Start of contracted service for wiring pattern photography and CAD data conversion of images.

X-ray CT enables the separation and extraction of wiring patterns on multilayer circuit boards! *CT imaging case study collection available.

To analyze the wiring and metal patterns of multilayer printed circuit boards, we used to cut the printed circuit boards layer by layer and conduct visual (visible light) inspections. This method destroys the printed circuit boards, making it difficult to analyze valuable boards, and non-destructive inspection is desired. On the other hand, conventional non-destructive X-ray CT imaging faced challenges in layer separation of multilayer printed circuit boards due to limitations in resolution and density resolution. We have now developed a new X-ray CT system that allows for high-resolution CT imaging of multilayer circuit boards, enabling layer separation. Additionally, we have adopted new CAD software to provide wiring patterns visualized in CAD format layer by layer. [Features] ■ Separation and extraction of wiring patterns of multilayer boards using X-ray CT ■ Provision of wiring patterns visualized in CAD format layer by layer ■ Conversion of images of circuit board wiring patterns into CAD data *For more details, please refer to the PDF document or feel free to contact us.

Other measurement, recording and measuring instrumentsX-ray inspection equipmentOther image-related equipment