Starting from October 1, 2020, we began offering contracted services for wiring pattern photography and CAD data conversion of images.

To analyze the wiring and metal patterns of multilayer substrates, printed circuit boards were cut layer by layer and visually inspected (using visible light). This method destroys the printed circuit boards, making it difficult to analyze valuable substrates, and non-destructive testing is desired.
On the other hand, conventional non-destructive X-ray CT imaging faced challenges in layer separation of multilayer printed circuit boards due to limitations in resolution and density resolution.
We have now developed a new X-ray CT system that allows for high-resolution CT imaging of multilayer circuit boards, enabling layer separation. Additionally, we have adopted new CAD software to visualize the wiring patterns layer by layer in CAD format for our clients.
*Please note that we will not be exhibiting at "SEMICON Japan 2020," which we have participated in every year. If you would like more details, please feel free to contact us.

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