Detailed customization is possible! Uniform film formation on high aspect ratio three-dimensional structures.
The "TFALD-201" is a research and development ALD system compatible with sublimation materials. It supports the deposition of metal oxides, precious metals, and composite metal films. Additionally, you can select suitable gas supply units according to the pressure of various materials and reaction gases. Furthermore, the material unit and gas supply unit can be added or removed as needed. 【Features】 ■ Compatible with sublimation materials ■ For research and development ■ Supports the deposition of metal oxides, precious metals, and composite metal films ■ Uniform film deposition on high aspect ratio three-dimensional structures ■ Detailed customization is possible *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 ■ The dual purge system (steady purge and momentary purge) efficiently discharges sublimation materials that tend to remain in the piping. ■ The control program automatically recognizes the installation status of units and options, so there is no need to change the program after expansion. ■ The partition structure controls the flow within the straight tube reaction chamber and adjusts the residence time before and after the partition to ensure reliable film formation. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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At Techno Fine Co., Ltd., we propose specifications, design, and manufacture equipment tailored to our customers' needs, including semiconductor manufacturing equipment such as vacuum deposition process devices, plasma-compatible substrate stages, and analytical instruments.