Latest! Ultra-fine circuit formation process for semiconductor package substrates.
New technology that responds to the miniaturization, thinness, lightweight, and high functionality of electronic devices! The latest process suitable for the fine patterning of semiconductor package substrates!
As the lightweight, thin, compact, and high-functionality of electronic devices progresses, semiconductor packages are required to have finer patterns. Semiconductor package substrates play roles such as providing electrical and mechanical connections, protecting semiconductors from external environments, and dissipating heat generated by semiconductor elements. Okuno Pharmaceutical Industry has newly developed a process that excels in fine circuit formation and connection reliability. From sample production to mass production, Okuno Pharmaceutical Industry coordinates surface treatment comprehensively. Please feel free to consult us about anything related to surface treatment.
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basic information
Okuno Pharmaceutical Industry manufactures and sells the following products: 1. Plating and surface treatment chemicals for printed circuit boards and electronic components 2. Plating and surface treatment chemicals for metals and plastics 3. Plating, anodizing (alumite), and surface treatment chemicals for aluminum and magnesium 4. Electroless nickel and other electroless plating solutions 5. Powder glass and glass paste for electronic materials and electronic components 6. Powder glass and glass paste for vehicles, building materials, industry, and glass decoration 7. Food additives, quality improvers, and texture modifiers 8. Commercial formulations for hygiene management and sanitation At Okuno Pharmaceutical Industry Co., Ltd., approximately 30% of our employees are researchers engaged in daily research and development activities for "manufacturing for manufacturing." We not only propose chemicals and processes that perfectly fit our customers' needs but also provide technical guidance and introductions to contractors, so please feel free to contact us.
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Semiconductor package substrate
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Company information
Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.