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  6. Process for forming an electroless nickel plating seed layer on polyimide film

Process for forming an electroless nickel plating seed layer on polyimide film

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last updated:Oct 31, 2022

奥野製薬工業 大阪・放出、東京、名古屋など
奥野製薬工業 大阪・放出、東京、名古屋など
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Introducing the latest surface treatments for flexible printed circuit boards used in smartphones, wearable devices, and more! Metallization using a wet process is possible.

Electronic devices such as smartphones are becoming smaller and more high-performance, and flexible printed circuit boards are used to meet the demands for lightweight and compact designs. Our company has newly developed a process that can form a nickel seed layer using a wet method, which is capable of responding to the miniaturization of circuits. This process is compatible with the semi-additive method, allowing for the formation of fine circuits.

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image19.JPG

Process for forming an electroless nickel plating seed layer on polyimide film

image19.JPG
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  • Related Link - https://www.okuno.co.jp/product/mf/

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Okuno Pharmaceutical Industry's surface treatment chemicals and inorganic materials are widely used in smartphones, semiconductors, electronic components, automobiles, and machine parts. Whether it's printed circuit boards, anodizing (alumite), plastic plating, electroless plating, or electroplating, you can rely on us for surface treatment. Okuno Pharmaceutical Industry provides total support for surface treatment from prototyping to mass production. Even ideas that initially seem like fantasies can be quickly turned into products, so please feel free to consult us about anything related to surface treatment.

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Flexible circuit boards used in smartphones, wearable devices, etc. FPC

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Process for forming an electroless nickel plating seed layer on polyimide film

Process for forming an electroless nickel plating seed layer on polyimide film

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奥野製薬工業

奥野製薬工業 大阪・放出、東京、名古屋など

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Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.

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