Plating process for polyimide (PI) film for flexible printed circuit boards (FPC)! Ideal for fine circuit formation and via hole methods!
The advancement and miniaturization of electronic devices have led to a demand for further speed and density in printed circuit boards. Particularly, polyimide is widely used as a material for flexible printed circuits (FPC) due to its excellent heat resistance and dielectric properties. However, traditional methods have had limitations in the miniaturization of wiring. Therefore, Okuno Pharmaceutical Industry has developed an optimal process for fine wiring formation. ◆ Nickel seed layer formation process on polyimide (PI) film ◆ ~ Top SAPINA Process ~ What's amazing about it! - The entire process is achieved using a wet method. - Unlike dry methods (such as vapor deposition and sputtering), it does not require large and expensive equipment. - It realizes cost reduction. - Both sides can be processed at once. - High peel strength. - Ensures high adhesion. - Enables fine nickel/gold plating.
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basic information
Okuno Pharmaceutical Industry manufactures and sells the following products: 1. Plating and surface treatment chemicals for printed circuit boards and electronic components 2. Plating and surface treatment chemicals for metals and plastics 3. Plating, anodizing (alumite), and surface treatment chemicals for aluminum and magnesium 4. Electroless nickel and other electroless plating solutions 5. Powder glass and glass paste for electronic materials and electronic components 6. Powder glass and glass paste for vehicles, construction materials, industry, and glass decoration 7. Food additives, quality improvers, and texture enhancers 8. Commercial formulations for hygiene management and sanitation At Okuno Pharmaceutical Industry Co., Ltd., approximately 30% of our employees are researchers engaged in daily research and development activities for "manufacturing for manufacturing." We not only propose chemicals and processes that perfectly suit our customers but also provide technical guidance and introductions to contractors, so please feel free to contact us.
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Company information
Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.
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