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  6. Aluminum electrode on wafer UBM formation plating process

Aluminum electrode on wafer UBM formation plating process

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last updated:Nov 14, 2024

奥野製薬工業 大阪・放出、東京、名古屋など
奥野製薬工業 大阪・放出、東京、名古屋など
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Plating chemicals, total proposals for surface treatment processes and equipment, aluminum electrodes on wafers, UBM formation, plating process.

UBM (Under Barrier Metal) employs electroless Ni/Au plating and electroless Ni/Pd/Au plating; however, conventional processes have faced challenges such as localized corrosion of aluminum electrodes, poor plating appearance, and adhesion issues. Additionally, in recent years, as power semiconductors have advanced towards higher voltage and higher current, there is an increasing demand for enhanced heat resistance in electroless plating films. In response, we have newly developed the "TORYZA EL PROCESS," a plating process for forming UBM on aluminum electrodes that suppresses film reduction and localized corrosion while exhibiting excellent uniform deposition, smoothness, and adhesion of electroless Ni plating. Along with the electroless plating equipment "TORYZA EL SYSTEM" for UBM formation, we offer a comprehensive proposal for plating chemicals, surface treatment processes, and equipment for semiconductor back-end processes.

    Chemicals
ウエハ上アルミニウム電極

Aluminum electrode on wafer UBM formation plating process

ウエハ上アルミニウム電極 UBM形成 めっきプロセス.png
ウエハ上アルミニウム電極 UBM形成 めっきプロセス.png
  • Related Link - https://www.okuno.co.jp/product/feature/toryza_el_…

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We are developing various plating and surface treatment chemicals and high-performance products for automobiles, electric vehicles, home appliances, and various electronics, so please feel free to contact us.

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Semiconductor wafer

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Aluminum electrode UBM formation on wafer - plating process

Aluminum electrode UBM formation on wafer - plating process

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奥野製薬工業

奥野製薬工業 大阪・放出、東京、名古屋など

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Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.

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