Electroless copper plating process for glass substrates for TGV surface treatment
In collaboration with Panasonic Environmental Engineering Co., Ltd., we have newly developed an electroless copper plating process called "PLOPX" that achieves high adhesion on glass substrates!
Glass has high smoothness and insulation properties, making it excellent in signal transmission characteristics and attracting attention as an interposer material necessary for 2.5D implementation in semiconductor packaging. Various adhesion layers have been researched for improving adhesion to glass materials, including sputtering methods and sol-gel methods. Our company has developed an electroless copper plating process called "PLOPX," which achieves high plating adhesion to glass substrates by using metal oxides deposited via Liquid Phase Deposition (LPD) as the adhesion layer. This process allows all steps to be treated using wet methods.
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basic information
Our company, in collaboration with Panasonic Environmental Engineering Co., Ltd., has developed an electroless copper plating process called "PLOPX," which achieves high adhesion to glass substrates. PLOPX forms a smooth metal oxide adhesion layer on glass substrates, which are gaining attention as interposer materials, through a liquid-phase deposition method, demonstrating excellent adhesion and heat resistance without compromising the properties of the glass material. Additionally, due to its all-wet process, it can also handle high aspect ratio TGV (Through Glass Via) substrates, making it promising for use as materials in high-speed communication systems for 5G and 6G. Even ideas that initially seem like fantasies can be quickly turned into products, so please feel free to consult us about any surface treatment needs.
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Interposer material (glass substrate)
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Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.
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