Developed a process that combines surface modification and plating to ensure high adhesion for liquid crystal polymers (LCP), known as the top LECS process.
Since 2020, following 4G, 5G mobile communication services have also started in Japan. 5G not only enables ultra-high-speed communication but also features ultra-low latency that allows for smooth operation of robots and other devices in remote locations, as well as the ability to connect multiple smartphones and computers simultaneously. Currently, high-frequency compatible substrates using low-dielectric materials such as LCP and fluorine-based resins are attracting attention as suitable materials for high-speed transmission. In particular, liquid crystal polymer (LCP) excels in electrical properties in the high-frequency range, has a low moisture absorption rate, and offers excellent dimensional stability, leading to its increasing adoption for 5G and millimeter-wave applications. Our company has developed a process that combines surface modification and plating to ensure high adhesion for LCP, which is said to have difficulty securing copper plating adhesion.
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basic information
The top LECS process is an electroless copper plating process developed specifically for LCP. This process is a direct plating method that does not use copper foil, and unlike dry methods (such as vapor deposition and sputtering), it can directly form circuits on LCP film without requiring large and expensive equipment. This process combines surface modification and plating, and after uniformly and finely roughening the surface layer of the LCP, it forms a dense plating film with low stress, demonstrating a high adhesion strength of over 6N/cm while maintaining low roughness even after applying thermal stress (150°C for 72 hours). It is compatible with roll-to-roll methods and semi-additive processes, and since the entire process can be achieved using wet methods, it contributes to improved productivity and finer wiring.
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Applications/Examples of results
High-speed communication and high-speed transmission applications
Company information
Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.
