Electrolytic Ni/Electrolytic Au plating with excellent corrosion resistance alternative plating process.
On printed circuit boards. A Pd coating with excellent corrosion resistance is formed, providing outstanding corrosion resistance.
The 'Electrolytic Ni/Electrolytic Au Plating Alternative Plating Process' forms a dense and corrosion-resistant Pd film between the electrolytic Ni plating and the electrolytic Au plating, resulting in excellent corrosion resistance. The solder wettability immediately after plating is almost equivalent to that of electrolytic Ni/electrolytic Au plating. For more details, please contact us or download the catalog.
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basic information
【Features】 ○ A dense and corrosion-resistant Pd coating is formed between the electrolytic Ni plating and electrolytic Au plating, providing excellent corrosion resistance. ○ Although a Pd coating is formed as an intermediate layer, the solder wettability immediately after plating is almost equivalent to that of electrolytic Ni/electrolytic Au plating. ○ Ideal for printed circuit boards. ○ Wide-ranging support from research and development to prototyping and mass production. ● For more details, please contact us or download the catalog.
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Applications/Examples of results
【Usage】 ○Printed Circuit Board
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Company information
Sankyo Co., Ltd. takes a solid step forward and delivers the highest quality as a specialist in surface treatment, capable of accurately responding to changes in the times. Through our work in surface treatment, we will continue to actively engage in D (meeting customer delivery requirements), Q (stable product quality), and C (rationalization for cost reduction), providing products that satisfy society (customers) while achieving the prosperity of the company and the improvement of employees' lives.
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