Electroless Ni-P/Replacement Au plating process with excellent corrosion resistance alternative plating process.
For printed circuit boards. An alternative plating process with excellent corrosion resistance using electroless Ni-P/replaceable Au plating.
The electroless Ni-P/replacement Au plating alternative plating process forms a dense and corrosion-resistant Pd film between the electroless Ni-P plating and the replacement Au plating, resulting in excellent corrosion resistance. Although a Pd film is formed as an intermediate layer, the solder wettability immediately after plating is almost equivalent to that of electroless Ni-P/replacement Au plating. For more details, please download the catalog or contact us.
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basic information
【Features】 ○ A dense and corrosion-resistant Pd coating is formed between the electroless Ni-P plating and the replacement Au plating, providing excellent corrosion resistance. ○ Although a Pd coating is formed as an intermediate layer, the solder wettability immediately after plating is nearly equivalent to that of electroless Ni-P/replacement Au plating. ○ Ideal for printed circuit boards. ○ Wide-ranging support from research and development to prototyping and mass production. ● For more details, please download the catalog or contact us.
Price information
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Delivery Time
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Applications/Examples of results
【Usage】 ○Printed Circuit Board
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Company information
Sankyo Co., Ltd. takes a solid step forward and delivers the highest quality as a specialist in surface treatment, capable of accurately responding to changes in the times. Through our work in surface treatment, we will continue to actively engage in D (meeting customer delivery requirements), Q (stable product quality), and C (rationalization for cost reduction), providing products that satisfy society (customers) while achieving the prosperity of the company and the improvement of employees' lives.
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