Next-generation power semiconductor wafer particle inspection equipment for SiC/GaN.
Non-patterned SiC bulk wafer 0.1μm detection. Detection of micro-scratches. Ideal for confirming the cleaning of SiC and GaN wafers. Automatic and manual transport options are available. Microscopic observation function allows for review after measurement.
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basic information
Detection sensitivity: 0.1μm (SiC bulk, bare silicon) Laser wavelength: 355nm Wafer size: 8 inches or smaller External dimensions: (W) 1530 x (D) 1200 x (H) 1900mm Power supply: (Electric) 100V (Compressed air) 0.4MPa or less, 6mm quick connector (Vacuum) -70kPa or less, 6mm quick connector, -40kPa or less, 8mm quick connector.
Price information
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Price range
P7
Delivery Time
Applications/Examples of results
Confirmation of cleaning for SiC/GaN wafers. Confirmation of contamination in the SiC process equipment chamber (process monitor). Confirmation of shipment for SiC/GaN wafers. Acceptance inspection of SiC/GaN wafers. Confirmation of quality for Epi/film deposition wafers.
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Company information
Our company was established in 1994 with the aim of developing and manufacturing inspection and testing equipment for semiconductor and liquid crystal manufacturing processes. Currently, we are focusing our business on semiconductor wafer inspection equipment, which is being adopted by a wide range of customers. In recent years, we have developed and sold particle inspection models for compound wafers that support energy-saving technologies and next-generation communications, and we are advancing into next-generation semiconductor inspection equipment. We will continue to strive to provide attractive products in the future.
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