Lead-free small-sized mounting board compatible compact N2 reflow device
The "NRY-520S-5Z" is a reflow device designed for electronic device manufacturers, aimed at improving temperature accuracy (in-plane temperature distribution) and soldering under low oxygen concentration. It is suitable for reflowing high-density mounted substrates through an independent upper and lower hot air circulation method that combines forced convection with a rectifying plate. 【Features】 - Clean room compatible, compact design, and energy-saving features - Equipped with five heating zones despite its small size - Capable of setting various temperature profiles - Can also be used for reflowing to form solder balls for BGA and CSP - Peripheral devices including loaders/unloaders and intermediate buffers are also available, etc. *For more details, please download the PDF or contact us.
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【Specifications (Excerpt)】 ■ Heating method: Forced convection heating from above and below ■ Temperature adjustment range: max. 350℃ ■ Temperature control accuracy: ±2.5℃ ■ Cooling method: Forced air cooling with a propeller fan (built-in circulating water cooling) ■ Number of zones: 6 zones (5 heating, 1 cooling) *For more details, please download the PDF or contact us.
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Our company continues to develop with the reliable technological capabilities we have cultivated so far, and we are a group of experts in "monozukuri" (manufacturing) that flexibly responds to changes in industry and society. We have established a comprehensive production management system that covers everything from design, can manufacturing, processing, assembly, testing, inspection, installation, to maintenance. The products that utilize the technology we have developed so far are widely supported by our customers.