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The "NRY-703WSZ/VA" is a single-chamber (1 zone) vacuum reflow device capable of preheating, heating, and cooling in a single chamber. Thanks to the floating gas extraction heating (Patent No. 5576577), thermal processing can be performed without the influence of warping or bending. Additionally, by injecting nitrogen, reflow soldering and bump formation can be achieved with an oxygen concentration of less than 10 ppm. 【Features】 ■ Void treatment during the formation of solder bumps on wafers ■ By reducing the chamber pressure during solder melting, void removal is possible ■ Supports automatic inline integration by connecting with the entrance conveyor (standard equipment) *For more details, please download the PDF or contact us.
The "NRY-103V6W/LU" is an N2 reflow device compatible with 200mm and 300mm printed bumps, which can also function as a wet back device after the plating bump process. The hot plate pins in the preheat zone utilize our unique liftable pins, enabling a two-stage heating temperature profile. (PAT.P) 【Features】 - Heating method combines hot plate and upper infrared heaters - The hot plate employs pin-based heating adapted to wafer warping - Excellent cleanliness within the furnace, and capable of low oxygen concentration (below 100ppm) - In-furnace transport uses our proprietary walking beam (PAT.) for tact feeding - Capable of high-precision transport with excellent cleanliness, among other features *For more details, please download the PDF or contact us.
The "NRY-101V6W/LU" is an N2 reflow device for bump formation after solder ball mounting or printing. The heating method combines a hot plate and an upper infrared heater. This allows for uniform temperature distribution through direct heat conduction. 【Features】 ■ Integrated loader and unloader design ■ Designed to fit the customer's magazine cassette ■ Handling into the furnace is made easy with a 3-axis clean robot, enabling inline integration with upstream equipment ■ A low-cost type that uses belt conveyor transport without a robot can also be manufactured ■ In-furnace transport is achieved through tact feeding with a walking beam (PAT.P), among other methods *For more details, please download the PDF or contact us.
The "NRY-626S-8Z" is a nitrogen reflow device compatible with lead-free solder, which achieves a stable temperature profile even during continuous operation through forced convection heating with twin fans. It comes standard with an in-furnace flux recovery system. By using a combination of a water-cooled trap and a high-density filter, the flux recovery efficiency is improved without compromising the oxygen concentration in the furnace. 【Specifications (excerpt)】 ■ Temperature adjustment range: max. 350℃ ■ Number of zones: 10 zones (8 heating, 2 cooling) ■ Flow direction: right to left, left to right ■ Conveyor transport reference: front reference or rear reference ■ Board overhang: 4mm or 5mm *For more details, please download the PDF or contact us.
The "NRY-520S-5Z" is a reflow device designed for electronic device manufacturers, aimed at improving temperature accuracy (in-plane temperature distribution) and soldering under low oxygen concentration. It is suitable for reflowing high-density mounted substrates through an independent upper and lower hot air circulation method that combines forced convection with a rectifying plate. 【Features】 - Clean room compatible, compact design, and energy-saving features - Equipped with five heating zones despite its small size - Capable of setting various temperature profiles - Can also be used for reflowing to form solder balls for BGA and CSP - Peripheral devices including loaders/unloaders and intermediate buffers are also available, etc. *For more details, please download the PDF or contact us.
