N2 reflow system for forming solder bumps compatible with 200-300mm wafers
The "NRY-103V6W/LU" is an N2 reflow device compatible with 200mm and 300mm printed bumps, which can also function as a wet back device after the plating bump process. The hot plate pins in the preheat zone utilize our unique liftable pins, enabling a two-stage heating temperature profile. (PAT.P) 【Features】 - Heating method combines hot plate and upper infrared heaters - The hot plate employs pin-based heating adapted to wafer warping - Excellent cleanliness within the furnace, and capable of low oxygen concentration (below 100ppm) - In-furnace transport uses our proprietary walking beam (PAT.) for tact feeding - Capable of high-precision transport with excellent cleanliness, among other features *For more details, please download the PDF or contact us.
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【Specifications (Excerpt)】 ■ Heating method: Hot plate heating, upper far infrared heating ■ Temperature adjustment range: Hot plate max. 390℃, far infrared max. 500℃ ■ Temperature accuracy: ±1.5℃ ■ Cooling method: Cooling plate air cooling ■ Number of zones: 6 zones (4 heating, 2 cooling) *For more details, please download the PDF or contact us.
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Our company continues to develop with the reliable technological capabilities we have cultivated so far, and we are a group of experts in "monozukuri" (manufacturing) that flexibly responds to changes in industry and society. We have established a comprehensive production management system that covers everything from design, can manufacturing, processing, assembly, testing, inspection, installation, to maintenance. The products that utilize the technology we have developed so far are widely supported by our customers.
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