N2 reflow system for solder bump formation compatible with 6.8-inch wafers
The "NRY-101V6W/LU" is an N2 reflow device for bump formation after solder ball mounting or printing. The heating method combines a hot plate and an upper infrared heater. This allows for uniform temperature distribution through direct heat conduction. 【Features】 ■ Integrated loader and unloader design ■ Designed to fit the customer's magazine cassette ■ Handling into the furnace is made easy with a 3-axis clean robot, enabling inline integration with upstream equipment ■ A low-cost type that uses belt conveyor transport without a robot can also be manufactured ■ In-furnace transport is achieved through tact feeding with a walking beam (PAT.P), among other methods *For more details, please download the PDF or contact us.
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【Specifications (Excerpt)】 ■ Heating method: Hot plate heating, upper far infrared heating ■ Temperature adjustment range: Hot plate max. 400℃, far infrared max. 500℃ ■ Temperature control accuracy: ±1.5℃ ■ Cooling method: Cooling plate air cooling ■ Number of zones: 6 zones (4 heating, 2 cooling) *For more details, please download the PDF or contact us.
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Our company continues to develop with the reliable technological capabilities we have cultivated so far, and we are a group of experts in "monozukuri" (manufacturing) that flexibly responds to changes in industry and society. We have established a comprehensive production management system that covers everything from design, can manufacturing, processing, assembly, testing, inspection, installation, to maintenance. The products that utilize the technology we have developed so far are widely supported by our customers.