Remove smearing after drilling holes such as blind vias and through holes with a laser drill!
SETO ENGINEERING Co., Ltd. handles the "Desmia Device." This device can remove smears after drilling blind vias and through holes using laser drills and other methods. The line configuration is single-lane, and the processing surface is double-sided. The device configuration includes unwinding, degreasing, etching, neutralization and reduction, pure water washing, liquid draining, drying, and winding. 【Specifications】 ■ Line configuration: 1 lane ■ Conveying speed: 0.5–1.0 m/min (depending on specifications) ■ Material width: 70 mm–160 mm (for FPC 250–300 mm) ■ Material thickness: PI 25 μm and above ■ Processing surface: double-sided *For more details, please refer to the PDF document or feel free to contact us.
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【Other Specifications】 ■ Equipment Configuration: Unwinding → Degreasing → Etching → Neutralization and Reduction → Pure Water Washing → Liquid Draining → Drying → Winding ■ Utilities: Power Supply AC200V・220V / 50Hz・60Hz City Water, Pure Water, Cooling Water, Scrubber, Heat Exhaust, (Steam) ■ Equipment Dimensions: 15 meters × 2.5mW × 2.5mH (approx.) *Control panel and ancillary equipment are separate *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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As a technology group specialized in roll-to-roll manufacturing equipment, SETO ENGINEERING Co., Ltd. has been reformed with the main technical staff from the former Seto Giken Kogyo Co., Ltd. We will continue to operate as a group of specialists in roll-to-roll manufacturing equipment. Additionally, SETO ENGINEERING has inherited all the technical know-how related to roll-to-roll from the former Seto Giken, so we will not only design and manufacture new roll-to-roll manufacturing equipment but also provide maintenance for various roll-to-roll manufacturing equipment delivered by the former Seto Giken.