Semi-additive pattern plating is also possible! We would like to introduce our molten copper plating equipment.
The device can perform electrolytic copper plating on blind vias and through holes. Material thickness ranges from PI 25μm, and material width is up to 540mm. Semi-additive pattern plating is also possible. Additionally, plating for CCL materials is available. Please feel free to consult us. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 0.5m to 1.5m/min (depending on specifications) ■ Material width: 540mm ■ Material thickness: PI 25μm and above ■ Processing surface: Both sides (one side or both sides) *For more details, please refer to the PDF document or feel free to contact us.
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【Other Specifications】 ■ Equipment Configuration: Unwinding → Degreasing → Acid Washing → Copper Plating → Rust Prevention → Pure Water Washing → Liquid Draining → Drying → Winding ■ Utilities: Power Supply AC200V・220V / 50Hz・60Hz City Water, Pure Water, Cooling Water, Scrubber, Heat Exhaust, (Steam) ■ Equipment Dimensions: Varies by specification (approximate) *Control panel and ancillary equipment are separate *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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As a technology group specialized in roll-to-roll manufacturing equipment, SETO ENGINEERING Co., Ltd. has been reformed with the main technical staff from the former Seto Giken Kogyo Co., Ltd. We will continue to operate as a group of specialists in roll-to-roll manufacturing equipment. Additionally, SETO ENGINEERING has inherited all the technical know-how related to roll-to-roll from the former Seto Giken, so we will not only design and manufacture new roll-to-roll manufacturing equipment but also provide maintenance for various roll-to-roll manufacturing equipment delivered by the former Seto Giken.