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  1. Home
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  3. Scientific and Physics Equipment
  4. Surface Treatment Equipment
  5. Plating Equipment
  6. No tooling required! "Wafer plating device"

No tooling required! "Wafer plating device"

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last updated:Jan 16, 2020

GDLAB合同会社
GDLAB合同会社
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A plating device that does not use jigs. It not only eliminates the complexity of installation and plating defects due to the deterioration of jig components, but also significantly improves the yield rate of good products!

The current wafer plating equipment is predominantly vertical, and the usability of the jigs attached to the plating devices is poor, leading to many issues such as the following: - Parts must be constantly replaced due to erosion from the plating solution. - Poor electrical conductivity results in defective plating. - The structure takes a long time to set the wafers, hindering smooth operations. - Difficult to transport, making efficient movement challenging. Furthermore, there is a demand for improved production efficiency due to the increasing need for high aspect ratio compatibility (supply of metal ions, uniform liquid flow) and enhanced uniform film thickness. Our "Wafer Plating Equipment" is jig-free, horizontal, and upward-facing, allowing us to resolve the issues present in conventional products. *For more details, please download the PDF or feel free to contact us.*

    Plating EquipmentSurface treatment contract service
2019-08-28_14h49_26.png

No tooling required! "Wafer plating device"

2019-08-28_14h49_26.png
2019-08-28_14h49_26.png
  • Related Link - https://www.gdlab.me/

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Plating Equipment Catalog (English Version)

Plating Equipment Catalog (English Version)

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Plating Equipment Development Proposal

Plating Equipment Development Proposal

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GDLAB合同会社

GDLAB合同会社

Machine elements and parts

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GDLAB LLC will contribute to society by inducing innovation using surface modification technologies that do not yet exist in the world. GD Coating is a heat-resistant fluorine coating characterized by four features, achieved by the fusion of composite processes that form a chemical reaction layer, resulting in strong adhesion and coating power. ■ Heat resistance ■ Thin film ■ Transparent film ■ Durability and performance exceeding fluorine Currently, it is being utilized for processing mirror finishes, precision molds, the interiors of fine tubes, and materials such as resin, rubber, and glass. Additionally, we provide high-aspect electroformed components used in semiconductor-related parts, medical device components, and micro molds. We have achieved thick electroforming of precious metals other than conventional Ni, Ni alloys, and copper using electroforming technology. We also offer ultra-functional coatings and wafer plating equipment, so please feel free to contact us.

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Transparent coating is possible! 'GD Coating' also has heat resistance.
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