The transfer speed is 2.0m/min, material thickness: compatible with PI 25μm and above! Introducing our electroless tin plating equipment.
This product is a device for electroless tin plating on wiring patterns. The transport speed is 2.0 m/min, and the material width is for TAB/CSP/COF ranging from 35 mm to 160 mm, and for FPC from 250 mm to 300 mm. The device consists of the following processes: unwinding → pretreatment → tin plating → post-treatment/water rinse → water wash → liquid separation → drying → winding. 【Specifications】 ■ Lane configuration: 2 Lane ■ Material thickness: PI 25 μm and above ■ Processing surface: single side ■ Utilities: Power supply AC 200V・220V / 50Hz・60Hz, city water, pure water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 38mL × 2.5mW × 2.5mH (approx.) *Control panel and ancillary equipment are separate. *For more details, please refer to the PDF document or feel free to contact us.
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As a technology group specialized in roll-to-roll manufacturing equipment, SETO ENGINEERING Co., Ltd. has been reformed with the main technical staff from the former Seto Giken Kogyo Co., Ltd. We will continue to operate as a group of specialists in roll-to-roll manufacturing equipment. Additionally, SETO ENGINEERING has inherited all the technical know-how related to roll-to-roll from the former Seto Giken, so we will not only design and manufacture new roll-to-roll manufacturing equipment but also provide maintenance for various roll-to-roll manufacturing equipment delivered by the former Seto Giken.