Please be sure to check the IH soldering device with your own eyes. You can confirm the actual machine at our company.
The IH soldering device 'S-WAVE' enables non-contact, pinpoint heating, making it possible to solder in narrow areas that are difficult to reach by hand. There is no concern about the surrounding solder areas re-melting, allowing for high-quality and efficient soldering even on high-density printed circuit boards. Even on boards with components that have a large difference in thermal capacity, it can be completed in one process, leading to improved productivity. 【Features】 ■ Compatible with terminals from φ0.3 to 1.5mm ■ Contributes to the automation of hand soldering and reduction of cycle time ■ Minimal consumables, low maintenance, and low running costs ■ Rapid heating with high output even in hard-to-heat areas ■ Achieves high-precision and high-speed soldering ■ Significantly reduces waste solder We encourage you to see this device with your own eyes.
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【Other Features】 ■ Automatic alignment and post-heat treatment are possible ■ Control of IH power output allows for customizable heating characteristics at each point ■ For terminals with a diameter of 0.6mm and a copper thickness of 70μm, the heating time is 3 seconds per point *For more details, please refer to the PDF document. If you would like to request sample processing or a demonstration with a demo machine, please contact us through the inquiry form.
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