A group of engineers specializing in ultra-precision machining! Leave ultra-precision cutting and grinding processing to us!
Shinko Seisakusho Co., Ltd. offers cutting and polishing technologies as professionals in ultra-precision machining and polishing. With ultra-precision cutting using a multi-wire saw, it is possible to cut materials such as silicon carbide, silicon nitride, cemented carbide, and tungsten. Dicing of small pieces can process tens of thousands of units at once. Additionally, ultra-precision polishing through single-sided and double-sided polishing allows for mirror polishing of φ2mm small pieces, SiC single crystals, and ceramics, with small piece polishing capable of processing tens of thousands of units at once. 【Business Activities】 ■ Precision polishing of mechanical and electronic components ■ Precision cutting of mechanical and electronic components ■ Polishing of optical single crystals *For more details, please refer to the PDF document or feel free to contact us.
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【Equipment Owned (Excerpt)】 ■Single-Sided Grinding Machine ■Double-Sided Grinding Machine ■Single-Sided Polishing Machine ■Double-Sided Polishing Machine ■High-Speed Centrifugal Barrel Machine ■Multi-Wire Saw ■Band Saw ■Blade Saw ■Single Wire Saw ■Surface Grinding Machine *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our main business focuses on precision processing of various hard materials, specializing in "grinding and cutting," including ceramics, crystalline materials, glass, metals, and resins. In recent years, we have particularly concentrated on ultra-precision cutting and polishing of various ceramics required for electronic components, as well as the power semiconductor field represented by SiC single crystals. In cutting technology, we can perform multi-wire cutting using a fixed abrasive method with diamond wire, and in polishing technology, we can achieve ultra-mirror polishing at the nano level. Additionally, in September 2023, we became Neos Group through M&A, establishing a consistent production system within the group that incorporates Neos's expertise in ultra-precision cleaning technology. If you have any issues with cutting, polishing, or cleaning processes, please feel free to contact Shinko Seisakusho!
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