The work size is a maximum of φ260mm × t0.5mm! We can also accommodate bevel cuts and groove machining!
Cutting processing is a method of cutting and shaping the target object, and by selecting the appropriate method, it can be processed with high precision. "Dice cutting processing" involves mounting on dicing tape suitable for the product and processing conditions, allowing for high-precision alignment cutting according to dicing cuts or patterns, as well as bevel cuts and groove processing. The main processing materials include alumina, aluminum nitride, and glass materials. 【Work Size】 ■ Maximum φ260mm × t0.5mm (High torque dicer φ300mm × t3.0mm) ■ Minimum cutting dimension: 0.2mm ■ Cutting precision: ±0.01mm *For more details, please refer to the PDF document or feel free to contact us.
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basic information
[Equipment Held] ■ 12-inch square table specification full-auto dicer with twin spindles ■ 8-inch table semi-auto dicer with 3-inch blade and 2-inch blade specifications ■ 6-inch table semi-auto dicer ■ Frame size 6-inch specification *For more details, please refer to the PDF document or feel free to contact us.
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Main Processing Materials ■ Alumina, Aluminum Nitride, Barium Titanate, Glass Materials, Silicon Wafers, Glass-Epoxy Resin Substrates, Piezoelectric Ceramics *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Shinko Co., Ltd. is a company located in Uonuma City, Niigata Prefecture, engaged in material development, precision processing of hard materials, and inspection contract services. Our company has been certified by Mitsuke City as a "Mitsuke SDGs Partner," a business or organization promoting SDGs together with Mitsuke City. With our capability to respond from prototyping to mass production and our high-precision processing technology, we meet various needs such as new product development, and we can provide integrated production support from material manufacturing to thin film microprocessing. We also accommodate a wide range of processes, from material manufacturing and fine processing to photolithography and inspection services.