We accept rework not only for equipment and embedded boards designed and manufactured by our company but also for boards implemented by other companies. Please feel free to consult with us.
This is a rework contract service for leadless components such as BGA, which are difficult to replace. By reworking components that could not be replaced until now, we reduce the costs associated with PCB disposal. Additionally, reusing components removed from discarded PCBs can help with cost reduction and EOL measures. After rework, we conduct checks using X-ray inspection equipment as necessary to inspect for misalignment and the condition of the solder joints. 【Examples】 ■ Replacement of leadless components such as BGA mounted on PCBs ■ Reuse of removed BGAs (reballing) ■ Cost reduction through the reuse of expensive components ■ EOL measures through the reuse of hard-to-obtain components *For more details, please download the PDF or feel free to contact us.
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【Rework Device Specifications】 ■ Manufacturer: ELSA ■ Model Number: IR/PL550A ■ Upper Heater: 60×60 mm, Total 800W, Medium Wave IR Heater Unit ■ Lower Heater: 150×250 mm, Total 800W, Medium Wave IR Heater Unit ■ Temperature Sensors: Non-contact x1, K-type Thermocouple Input x4 ■ Supported Board Size (Maximum): 300×400 mm ■ Supported Component Size (Maximum): 40×40 mm *For more details, please download the catalog or contact us.
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For more details, please download the PDF or feel free to contact us.
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With over 30 years of experience in the design and production of systems, devices, packages, and modules centered around wireless technology through ODM, OEM, and EMS, we have provided products ranging from reliable devices to embedded products. We possess extensive experience in responding to both public market products and industrial market products, focusing on wireless technology, and accommodating a wide variety of low-volume embedded and standalone products. Furthermore, we offer comprehensive support not only in manufacturing but also in design, on-site adjustments and testing, maintenance, and repair. Moving forward, we will continue to support our customers in the IoT market with combinations of wireless and imaging technologies, as well as wireless and sensor technologies.