Railway and vehicle-mounted, 10th generation CPU compatible, extended temperature support.
Features ■ Width 260 × Height 79 × Depth 240 mm, 4.93 liters ■ 10th generation workstation-class Intel Xeon/Core i9/i7/i5/i3 CPU (Comet Lake-S) ■ Two DDR4 2933MHz memory slots, expandable up to 64GB (ECC memory option available) ■ Equipped with three external Nano SIM sockets, supporting 5G/WiFi 6/4G/3G/LTE/GPRS/UMTS ■ Software-based ignition control, TPM 2.0 support ■ User-friendly maintenance design ■ One-stop AIoT solution proposal with OpenVINO x VHub AI option ■ Extended temperature range -40 to 75℃ (when equipped with 35W TDP CPU) ■ Wide DC input 9-50V (80V surge protection) ■ Control via ignition key (16 modes) ■ Certified to railway standard EN50155
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basic information
Specifications ■CPU/Chipset: 10th Generation Xeon/Core i9/i7/i5/i3 / W480E ■Memory: DDR4-2933MHz SO-DIMM x 2 (up to 64GB) ■Expansion Slots: PCIe[x16] x1/PCI x1 ■Storage: 2.5"HDD/SSD SATA3 x2, mSATA x2, M.2 Key M x1 ■I/O Connectors: Ethernet: GigE x6, GigE(PoE) x4, USB3.2 x6, USB2.0 x1, RS-232/422/485 x4, DVI-I x1, DVI-D x1, DP x2, 32 Isolated DIO(16 DI, 16 DO) x1, Mic-in, Line-out ■Input Power: DC 9–50V input ■Operating Temperature: CPU 35W/65W/80W–95W: -40–75/55°C (fanless)/55°C ■Dimensions (mm)/Weight (kg): 260(W)x79(H)x240(L) / 4.5kg
Price information
Open price
Delivery Time
※It may vary depending on the quantity and timing, so please feel free to contact us.
Applications/Examples of results
For machine, factory, and building automation/monitoring systems.
Line up（23）
| Model number | overview |
|---|---|
| ECX-2210MX | 6 GigE LAN (4 PoE+(M12)), Isolated DIO, 1 PCIe[x16] |
| ECX-2210MXF | 6 GigE LAN (4 PoE+(M12)), Isolated DIO, 1 PCIe[x16], FAN sink (supports 95W TDP CPU) |
| ECX-2201MX | 6 GigE LAN (4 PoE+(M12)), Isolated DIO, 1 PCI |
| ECX-2201MXF | 6 GigE LAN (4 PoE+(M12)), Isolated DIO, 1 PCI, FAN sink (supports 95W TDP CPU) |
| ECX-2210 | 6 GigE LAN (4 PoE+), Isolated DIO, 1 PCIe[x16] |
| ECX-2210F | 6 GigE LAN (4 PoE+), Isolated DIO, 1 PCIe[x16], FAN sink (supports 95W TDP CPU) |
| ECX-2201 | 6 GigE LAN (4 PoE+), Isolated DIO, 1 PCI |
| ECX-2201F | 6 GigE LAN (4 PoE+), Isolated DIO, 1 PCI, FAN sink (supports 95W TDP CPU) |
| CPU Xeon W-1290E | 10th Gen Xeon W-1290E (20M Cache, 4.8GHz, 95W TDP, supports ECC memory) |
| CPU Xeon W-1290TE | 10th Gen Xeon W-1290TE (20M Cache, 4.5GHz, 35W TDP, supports ECC memory) |
| CPU Xeon W-1270E | 10th Gen Xeon W-1270E (16M Cache, 4.8GHz, 80W TDP, supports ECC memory) |
| CPU Xeon W-1270TE | 10th Gen Xeon W-1270TE (16M Cache, 4.4GHz, 35W TDP, supports ECC memory) |
| CPU Xeon W-1250E | 10th Gen Xeon W-1250E (12M Cache, 4.7GHz, 80W TDP, supports ECC memory) |
| CPU Xeon W-1250TE | 10th Gen Xeon W-1250TE (12M Cache, 3.8GHz, 35W TDP, supports ECC memory) |
| CPU Core i9-10900E | 10th Gen Core i9-10900E (20M Cache, 4.7GHz, 65W TDP) |
| CPU Core i9-10900TE | 10th Gen Core i9-10900TE (20M Cache, 4.5GHz, 35W TDP) |
| CPU Core i7-10700E | 10th Gen Core i7-10700E (16M Cache, 4.5GHz, 65W TDP) |
| CPU Core i7-10700TE | 10th Gen Core i7-10700TE (16M Cache, 4.4GHz, 35W TDP) |
| CPU Core i5-10500E | 10th Gen Core i5-10500E (12M Cache, 4.2GHz, 65W TDP) |
| CPU Core i5-10500TE | 10th Gen Core i5-10500TE (12M Cache, 3.7GHz, 35W TDP) |
| CPU Core i3-10100E | 10th Gen Core i3-10100E (6M Cache, 3.8GHz, 65W TDP, supports ECC memory) |
| CPU Core i3-10100TE | 10th Gen Core i3-10100TE (6M Cache, 3.6GHz, 35W TDP, supports ECC memory) |
| Options | 280W/160W Industrial AC Adapter, VESA Mount Kit, DIN-RAIL Kit, DDR4 Memory (4GB/8GB/16GB/32GB) |
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Company information
Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.