Close and intimate engineering support! Application of a uniquely designed efficient manufacturing process! Wedge bonding type wire bonder.
Micro Point Pro Co., Ltd. is a supplier of Heavy Wire Wedges (HWW) and large ribbon wedges, supporting major manufacturers of power devices for various types of applications, including automotive, electric vehicles (EV), and semiconductors. Everything is done in-house, applying a uniquely designed and efficient manufacturing process, and implementing top-class integrated QC and QA for the next HWW tools. Our specialized engineering team continuously collaborates with customers to support cost reduction projects, improve uptime, and enhance MTBA without compromising on quality and performance. *For more details, please refer to the related links page.
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【Features】 ■ Strict QC and QA for high precision and reproducibility ■ Top performance bonding and lifespan ■ Certification by major customers ■ Short lead times ■ Attractive pricing ■ Support for consignment sales and other "custom-made" solutions ■ Assistance with customer inquiries regarding new designs and applications ■ Special tool options for longer lifespan ■ Special marking options: s/n, QR code *For more details, please refer to the related link page.
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Micro Point Pro Ltd (MPP) was established in 2010 following the acquisition of the backend tool manufacturing line from Kulicke & Soffa (K&S). This acquisition included knowledge and know-how supported by highly skilled employees with over 40 years of experience. Since then, MPP has established itself as a global leader in both backend and frontend in the semiconductor market. We have been able to provide comprehensive solutions to meet the evolving needs of our customers through the development and acquisition of additional manufacturing processes. MPP has the capability and expertise to respond to the demand and support for high-precision consumable tools in the microelectronics industry. Our products cover all major packaging processes and applications, specializing in probe head solutions for resistance measurement testing of wafers or thin conductive films.