Wire bonder for various applications such as automobiles, electric vehicles (EVs), and semiconductors, using the wedge bonding method.
Micro Point Pro Co., Ltd. is a major supplier of heavy wire wedges (HWW) and large ribbon wedges that support leading manufacturers of power devices for various applications, including automotive, electric vehicles (EVs), and semiconductors. All processes are carried out in-house using MPP's best-in-class quality control and assurance applied to HWW tools, utilizing an efficient self-designed manufacturing process. We continuously collaborate with our customers to support special "cost reduction" projects with our unique chip designs and proprietary TC materials that offer excellent "low build-up" performance, all while reducing costs and improving uptime and mean time between failures (MTBF) without compromising quality or performance. *You can download the English version of the catalog. *For more details, please refer to the related links page.
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【Features】 ■ Strict quality control/quality assurance, high precision and reproducibility ■ Best performance: bonding and durability ■ Certification by major customers ■ Short lead times ■ Support for consignment sales and other "custom-made" solutions ■ Assistance with inquiries regarding new designs and applications
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*You can download the English version of the catalog. *For more details, please see the related links page.
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Company information
Micro Point Pro Ltd (MPP) was established in 2010 following the acquisition of the backend tool manufacturing line from Kulicke & Soffa (K&S). This acquisition included knowledge and know-how supported by highly skilled employees with over 40 years of experience. Since then, MPP has established itself as a global leader in both backend and frontend in the semiconductor market. We have been able to provide comprehensive solutions to meet the evolving needs of our customers through the development and acquisition of additional manufacturing processes. MPP has the capability and expertise to respond to the demand and support for high-precision consumable tools in the microelectronics industry. Our products cover all major packaging processes and applications, specializing in probe head solutions for resistance measurement testing of wafers or thin conductive films.