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  5. Printed Circuit Board
  6. Large high multi-layer, large, long-length substrate

Large high multi-layer, large, long-length substrate

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last updated:Dec 21, 2021

モリマーエスエスピー 本社
モリマーエスエスピー 本社
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Motherboards for information and communication devices, capable of producing super-large sizes for BTB applications!

We can manufacture large circuit boards for motherboard, backboard, and server applications. We support up to 24 layers with dimensions of 750mm × 1,100mm. 【Features】 ■ Maximum product size: 1050 × 570mm ■ Capable of core processing with copper thickness of 300–400μm ■ Maximum total thickness: t5.0–6.0mm *For more details, please refer to the PDF document or feel free to contact us.

    Printed Circuit Board
スクリーンショット

Large high multi-layer, large, long-length substrate

スクリーンショット 2021-12-21 155734.png
スクリーンショット 2021-12-21 155734.png

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High-precision, high-heat-dissipation device substrate / ultra-thin glass cloth multilayer substrate

High-precision, high-heat-dissipation device substrate / ultra-thin glass cloth multilayer substrate

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モリマーエスエスピー

モリマーエスエスピー 本社

Resin/Plastic

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Morimar SSP Co., Ltd. is engaged in the development, manufacturing, processing, and sales of various synthetic resins and chemicals, as well as their raw materials. Utilizing the production systems of the Morimar Group both domestically and internationally, we are expanding our global initiatives across a wide range of products, including FRP raw materials and molded products, glass fibers, printed circuit boards, resin raw materials, and functional films, targeting markets both in Japan and abroad.

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