We have a manufacturing record of up to 22 layers, and we can accommodate various specifications for board thickness and copper foil thickness!
We would like to introduce the "multilayer circuit boards" handled by Matsuwa Sangyo Co., Ltd. These are formed by stacking multiple layers of insulation and conductor layers, resulting in printed circuit boards with three or more conductor patterns. The interlayer connections are formed by through-holes (TH) just like in double-sided boards, and we offer a variety of substrates including FR-4, halogen-free materials, high heat-resistant materials, and low dielectric materials. 【Shortest Delivery Record】 ■ 4 to 10 layers ⇒ Shipped on the 1.05th day (data by 8 PM ⇒ shipped the next day) ■ 12 to 14 layers ⇒ Shipped on the 1.1th working day (data by 4 PM ⇒ shipped the next day) ■ 16 to 18 layers ⇒ Shipped on the 2.1th working day (data by 4 PM ⇒ shipped the day after next) *For more details, please refer to the related links or feel free to contact us.
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Our entire staff takes responsibility and consistently manufactures all processes of printed circuit board production in our own factory, enabling us to respond to short delivery times that others cannot achieve. We provide a wide variety of printed circuit boards, from single-sided to high multilayer, for applications such as musical instruments, toilets, mobile phones, automotive, and space development. We possess state-of-the-art equipment and can also accommodate short delivery times for high-difficulty boards and flexible boards. Our motto is "Change & Challenge." We are not afraid of transformation and will continue to challenge ourselves! Please feel free to contact us with your requests. Remote face-to-face meetings are also possible!
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![[IH Soldering Case] Large Heat Capacity Substrate](https://image.mono.ipros.com/public/product/image/515/2001053178/IPROS28199257971935562579.png?w=280&h=280)
