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  6. State analysis using EPMA

State analysis using EPMA

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last updated:Jun 26, 2025

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Estimate bonding states by comparing with standard spectra! Introducing state analysis using EPMA.

In the state analysis using EPMA, changes (shifts and shapes) in the characteristic X-ray peak wavelengths due to differences in the chemical bonding states (ionic valence, crystal structure, coordination number) of oxides and silicates are utilized to estimate the bonding states by comparing with standard spectra. In the identification of two types of copper oxides, when distinguishing between black CuO and red Cu2O by color is difficult, especially for microscopic objects that require an electron microscope, it is possible to grasp the oxidation state using EPMA. Additionally, while XPS is effective for measuring thin oxide layers on aluminum surfaces, EPMA can be used to understand the oxidation state of small foreign particles, bulk materials, and composites. 【Device Specifications】 ■ Manufacturer: JEOL Ltd. Jeol-8200 ■ Analysis Method: Wavelength Dispersive X-ray Analysis (WDX) ■ Analyzable Elements: B to U ■ Energy Resolution: 20 eV (EDX is approximately 130 eV) ■ Detection Limit: 0.01% and above ■ Maximum Sample Size: 100x100 mm *For more details, please refer to the PDF document or feel free to contact us.

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State analysis using EPMA

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State analysis by EPMA

State analysis by EPMA

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[Analysis Example by EBSD] Chip

[Analysis Example by EBSD] Chip

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[Example of analysis using EBSD] Screw

[Example of analysis using EBSD] Screw

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[Example of analysis using EBSD] Pipe

[Example of analysis using EBSD] Pipe

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[Example of analysis using EBSD] Via

[Example of analysis using EBSD] Via

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[Example of Analysis by EBSD] High Melting Point Solder

[Example of Analysis by EBSD] High Melting Point Solder

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Example of analysis using EBSD: steel plate

Example of analysis using EBSD: steel plate

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Crystal analysis by EBSD BGA

Crystal analysis by EBSD BGA

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Crystal analysis by EBSD: Intermetallic compounds in solder joints

Crystal analysis by EBSD: Intermetallic compounds in solder joints

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EBSD analysis

EBSD analysis

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Crystal analysis of Cu using the EBSD method.

Crystal analysis of Cu using the EBSD method.

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Example of analysis using the EBSD method

Example of analysis using the EBSD method

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EBSD analysis of flexible printed circuits (FPC)

EBSD analysis of flexible printed circuits (FPC)

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Example of analysis using EBSD (ceramics)

Example of analysis using EBSD (ceramics)

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[Data] Whisker Analysis by EBSD

[Data] Whisker Analysis by EBSD

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Example of analysis using EBSD: crab claw

Example of analysis using EBSD: crab claw

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Detection sensitivity due to differences in acceleration voltage during SEM-EDX analysis.

Detection sensitivity due to differences in acceleration voltage during SEM-EDX analysis.

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Seven spectral crystals in EPMA analysis

Seven spectral crystals in EPMA analysis

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[Data] Example of EPMA Analysis

[Data] Example of EPMA Analysis

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[Data] EPMA Analysis Example 2

[Data] EPMA Analysis Example 2

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Example of EPMA analysis using the guide network map method.

Example of EPMA analysis using the guide network map method.

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Electronic Components and Semiconductors

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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