Stacked water-cooled plate

In addition to 8 types of standard products, custom manufacturing is possible! The plating serves as the base material, allowing for highly reliable joints.

In recent years, there has been an increasing demand for "laminated water-cooled plates" in fields such as semiconductors, lasers, fuel cells, and thermoelectric conversion. Our company has adopted the P-B bonding method, which combines plating and brazing, allowing us to provide products that are significantly more cost-effective and reliable compared to conventional diffusion bonding methods. The sizes range from a minimum of about 10 mm square and a thickness of 0.9 mm, to a maximum of about 300 mm square, with layering possible up to several dozen layers. In addition to eight types of standard products, custom manufacturing is also available. 【Features】 ■ The plate is plated and heated in a hydrogen furnace or vacuum furnace. ■ The plating serves as the filler material, enabling highly reliable bonding. ■ Fine processing through etching allows for the formation of complex water channels. ■ While it is primarily made of oxygen-free copper, it can also be produced in materials like stainless steel. *For more details, please refer to the PDF document or feel free to contact us.

Other electronic partsContract manufacturingHeating device