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  6. Slitting, Surface Treatment, and Thermal Lamination for Electronic Materials [Kawamura Sangyo]

Slitting, Surface Treatment, and Thermal Lamination for Electronic Materials [Kawamura Sangyo]

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last updated:Jun 08, 2021

河村産業
河村産業
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[Presentation of 4 Technical Introduction Materials] We respond from prototyping to mass production! We also support material procurement. We accommodate electronic materials that require high functionality, such as those for 5G products.

At Kawamura Industries, we create and provide electronic materials with various functions by integrating processes such as slitting, plasma surface treatment, sputtering, and thermal lamination. We can handle everything from prototyping to mass production, including material procurement. We welcome inquiries for small lot requests as well. 【Our Technologies】 ■ Slitting With about 50 years of extensive experience, we can accommodate slit widths from 2mm to 2,000mm. We can process in clean rooms as well as in yellow rooms. ■ Plasma Surface Treatment Effective for improving the adhesion of low-adhesion films like fluorine films. Our roll-to-roll equipment allows for rapid mass production startup. ■ Thermal Lamination We have a vacuum thermal press capable of handling high temperatures up to 400°C within a clean room. Our laminating machines can also operate in a clean environment from the preparation stage. ■ Sputtering We possess roll-to-roll equipment. In collaboration with partner companies, we can also perform electrolytic copper plating on sputtered materials using roll-to-roll methods. *You can view technical documents and introductory materials regarding the above processing technologies from the <PDF Download>. Please feel free to contact us with any inquiries.

    Processing ContractSurface treatment contract serviceplastic
2020年度特集コラム(製品画像)2.png

Slitting, Surface Treatment, and Thermal Lamination for Electronic Materials [Kawamura Sangyo]

2020年度特集コラム(製品画像)2.png
2020年度特集コラム(製品画像)2.png
  • Related Link - https://www.kawamura-s.co.jp/

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【Introduction to Downloadable Materials】 - Introduction Material "Slitting Processing - Kawamura Industries' Slitting Processing Technology" - Technical Material "Basics of Plasma Treatment - Plasma Surface Treatment and 5G" - Introduction Material "Thermal Lamination Processing - Kawamura Industries' Thermal Lamination Processing Technology" - Technical Material "Basics of Sputtering Processing - Sputter Film Formation and 5G" *The above materials can be viewed from <PDF Download>. 【About ISO Certification】 Our company has obtained 'ISO 9001' and 'ISO 14001' across the entire organization.

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[Introduction Materials] Slitting Processing - Kawamura Industries' Slitting Processing Technology

[Introduction Materials] Slitting Processing - Kawamura Industries' Slitting Processing Technology

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[Technical Document] Basics of Plasma Treatment - Plasma Surface Treatment and 5G

[Technical Document] Basics of Plasma Treatment - Plasma Surface Treatment and 5G

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[Introduction Materials] Thermal Lamination Processing - Kawamura Sangyo's Thermal Lamination Processing Technology

[Introduction Materials] Thermal Lamination Processing - Kawamura Sangyo's Thermal Lamination Processing Technology

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[Technical Document] Basics of Sputtering Process - Sputter Deposition and 5G

[Technical Document] Basics of Sputtering Process - Sputter Deposition and 5G

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News about this product(3)

We will be exhibiting at the Adhesive and Bonding Technology Exhibition 2024 held on May 24, 2024.

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We are pleased to announce that we will be exhibiting at the Adhesive and Adhesion Technology Exhibition 2024, held at the Osaka Industry Creation Center. Attendance is by complete advance registration only. We warmly invite you to visit our booth when you come. Under the theme "Kawamura Industries: ROLL to ROLL Vacuum Plasma Surface Treatment!" we will showcase not only ROLL to ROLL processing with vacuum plasma treatment but also continuous thermal lamination processing, vacuum thermal pressing, and composite technologies that combine these methods. ◆ Exhibition Details ◆ Exhibition Name: Adhesive and Adhesion Technology Exhibition 2024 *Advance registration required Advance Registration Method: Please register using the URL in the related link. Date and Time: May 24, 2024 (Friday) 10:30 AM - 4:30 PM Venue: Osaka Industry Creation Center, 3rd and 4th Floors *Reception on the 4th Floor

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Adhesive Technology Exhibition 2023

We will be exhibiting at the Adhesive and Bonding Technology Exhibition 2023 held on June 16, 2023.

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We will be exhibiting at the "Adhesive and Adhesion Technology Exhibition 2023" held at the Osaka Industrial Creation Center. Attendance is by complete advance registration only. When you visit, please be sure to stop by our booth. We sincerely look forward to seeing you. This time, we plan to mainly showcase improvements in the adhesion of fluororesins through plasma treatment. ◆ Exhibition Details ◆ Exhibition Name: Adhesive and Adhesion Technology Exhibition 2023 *Advance registration required Advance Registration Method: Please register using the URL from the related link. Date and Time: June 16, 2023 (Friday) <First Session> 10:30-12:00 <Second Session> 13:00-14:30 <Third Session> 15:00-16:30 Venue: Osaka Industrial Creation Center, 3rd Floor Our Booth Location: Booth 29

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Functional Film Expo 2022

We will be exhibiting at the Functional Film Expo 2022 held on July 27-28, 2022.

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We will be exhibiting at the Functional Film Exhibition held at the Osaka Industrial Creation Center, which received great acclaim last year. Due to COVID-19 measures, attendance is by complete prior registration only, but we sincerely invite you to visit our booth when you come. We look forward to seeing you. This time, we plan to showcase: ★ Plasma surface treatment processing ★ Polyimide laminated sheets ★ Transparent polyimide films ◆ Exhibition Details ◆ Exhibition Name: Functional Film Exhibition 2022 *Complete prior registration required How to Register: Please register via the URL in the related links. Date and Time: <Day 1> July 27, 2022 (Wednesday) 13:30-17:00 <Day 2> July 28, 2022 (Thursday) 10:00-16:00 Venue: Osaka Industrial Creation Center 3F・4F *Reception is on the 4th floor

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河村産業

河村産業

Manufacturing and processing contract

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Our company specializes in insulation processing, electronic materials, and microfabrication, achieving high quality, high performance, and timely production through high technology and refined skills.

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