Supports plating specifications! Often produced using bridge-less etching.
Introducing the lid used for sealing ceramic packages. This product is often produced using low thermal expansion Kovar material and features bridge-less etching that does not leave bridge marks. It is also available in a plated specification. 【Product Specifications】 ■Material: Kovar ■Thickness: 0.4mm *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Photolithography, essential in the ever-evolving advanced fields, is a service we have provided by combining various photolithography technologies, earning your continued support. Moving forward, we will consistently focus our energy on technological innovation, creating a bright future with you through reliable technology and rich proposal capabilities.