A hollow structure for enclosing liquid, with a fin structure on the lid side to enhance heat dissipation!
We would like to introduce a cooling component that utilizes the vaporization of liquid and capillary phenomena. In this sample, a hollow structure is formed on the case side to encapsulate the liquid, and a fin structure is created on the lid side to enhance heat dissipation, using half processing, which is our specialty in etching. 【Product Specifications】 ■Material: Oxygen-free copper ■External dimensions: 80×50mm ■Thickness: 0.5mm×2 layers *For more details, please refer to the PDF document or feel free to contact us.
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Photolithography, essential in the ever-evolving advanced fields, is a service we have provided by combining various photolithography technologies, earning your continued support. Moving forward, we will consistently focus our energy on technological innovation, creating a bright future with you through reliable technology and rich proposal capabilities.