A hollow structure for enclosing liquid, with a fin structure on the lid side to enhance heat dissipation!
We would like to introduce a cooling component that utilizes the vaporization of liquid and capillary phenomena. In this sample, a hollow structure is formed on the case side to encapsulate the liquid, and a fin structure is created on the lid side to enhance heat dissipation, using half processing, which is our specialty in etching. 【Product Specifications】 ■Material: Oxygen-free copper ■External dimensions: 80×50mm ■Thickness: 0.5mm×2 layers *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Photolithography, essential in the ever-evolving advanced fields, is a service we have provided by combining various photolithography technologies, earning your continued support. Moving forward, we will consistently focus our energy on technological innovation, creating a bright future with you through reliable technology and rich proposal capabilities.
![[Processing Example] Industrial Products](https://image.mono.ipros.com/public/product/image/504/2001016319/IPROS40170337313513230479.png?w=280&h=280)
![Micron-level precision, high difficulty × short delivery time! Precision cutting processing [Processing case examples available].](https://image.mono.ipros.com/public/product/image/2070746/IPROS9035842601074547405.png?w=280&h=280)