Utilizing the high processing flexibility of etching! This is a manufacturing example that enhances heat dissipation.
Introducing a copper heat sink with high thermal conductivity. Utilizing the high processing flexibility of etching, we have formed dimples, embossing, slits, and fin shapes to increase the surface area and enhance heat dissipation. 【Product Specifications】 ■Material: Oxygen-free copper ■Thickness: 1.0mm ■Combination of half processing and through processing by etching *For more details, please refer to the PDF document or feel free to contact us.
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Photolithography, essential in the ever-evolving advanced fields, is a service we have provided by combining various photolithography technologies, earning your continued support. Moving forward, we will consistently focus our energy on technological innovation, creating a bright future with you through reliable technology and rich proposal capabilities.