Sample orders for the vehicle-mounted device interface conversion IC 'S2D13V70' have begun.
We have developed the 'S2D13V70', an interface conversion IC for automotive devices that converts video signals from eDP (Embedded DisplayPort) to OpenLDI (open LVDS display interface), and we have now started accepting sample orders. Both eDP and OpenLDI are interface standards for transmitting video signals to displays. Compared to the widely adopted OpenLDI, eDP is characterized by its ability to transmit high-speed, high-resolution video. 【Features】 ○ eDP-OpenLDI interface conversion IC compliant with automotive standards ○ Equipped with a splitter function, capable of simultaneously outputting the same resolution image to two displays within the Full-HD range.
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【Product Specifications】 ○Model Number: S2D13V70 ○Power Supply Voltage: 3.3V (I/O) 1.8V (Internal Core Voltage) ○Input Interface: eDP rev.1.4a × 2Lane, Maximum 2.7Gbps/lane ○Output Interface: OpenLDI-Tx × 2Ch, Maximum 120MHz/ch ○Display Resolution: Up to 1920×1200@60fps ○Image Correction: 8-Bit Digital Gamma LUT + 2-bit Dithering ○Safety Features: SPI Connection (Checksum with 16Byte Cache) Input Pixel Clock/Sync Signal Monitoring CRC (Full Screen/Register Settings/Frame Comparison) ○Compliance with Automotive Standards: AEC-Q100 ○Operating Temperature Range: -40 to +105℃ ○Others: System Clock: 48MHz Splitter Function ○Package: PFBGA8-81 (8mm×8mm×1.2mm/Pitch: 0.8mm)
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This product meets the strict quality requirements for automotive use with a maximum operating temperature of 105°C. It also has robust safety features, including a "CRC function" that monitors whether the video signal output by the ECU is being received correctly, and a "blank screen function" that can mask the display with a specific image pattern when an anomaly is detected in the transmission path between the ECU and this product, supporting the safety functions required for automotive equipment.
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At Epson, we are developing energy-efficient, compact, and high-precision devices to realize the smart transformation of social infrastructure. We also integrate crystal and semiconductor technologies to propose optimal solutions for each application.