How about cutting processing that can accurately cut not only width/depth/height but also right angles?
Cutting ceramics involves various requirements, including dimensions in the XYZ directions of width, depth, and height, as well as factors like perpendicularity. There are also various cutting methods, such as slicing, dicing, and laser cutting. Lead adopts the dicing method, which can comprehensively solve issues related to high finishing precision, variation control during mass production, and cost performance. Specifically, high finishing precision is achieved through image recognition, variation control during mass production is managed with NC control, and cost performance is ensured by utilizing mature technologies.
Inquire About This Product
basic information
【Equipment Owned】 ■ Dicing Machine ■ Cleaning Machine ■ UV Exposure Machine ■ Image Dimension Measuring Device ■ Reading Microscope ■ 3D CAD ■ Clean Room Equipped
Price range
Delivery Time
Applications/Examples of results
【Dicing Examples (Excerpt)】 ■ Fixed Pitch Cut - Material: Silicon Wafer - Work Thickness: 0.7mm - Cut Width: 0.05mm ■ Groove Processing Cut - Material: Aluminum Nitride - Work Thickness: 1.0mm - Groove Depth: 0.5mm
Company information
We are a company based in Ube City, Yamaguchi Prefecture, with 50 years of history, primarily engaged in various processing of semiconductors and ceramic devices. Through many years of experience in responding to diverse needs, we have cultivated unwavering trust and technical expertise. We will continue to challenge ourselves to create new value through innovative approaches.
![[Processing Example] Fixed Pitch Cut](https://image.mono.ipros.com/public/product/image/a87/2000592230/IPROS56659030623071506259.png?w=280&h=280)
![[Processing Example] Multi-Size Cut](https://image.mono.ipros.com/public/product/image/54a/2000592241/IPROS67165984129151422282.png?w=280&h=280)
![[Processing Example] Multi-Angle Cut](https://image.mono.ipros.com/public/product/image/008/2000592243/IPROS45352811176206579859.png?w=280&h=280)
![[Processing Example] Full Cut](https://image.mono.ipros.com/public/product/image/f83/2000592244/IPROS56797084922677407157.png?w=280&h=280)
![[Processing Example] Half Cut](https://image.mono.ipros.com/public/product/image/4e8/2000592245/IPROS45800580001709181188.png?w=280&h=280)
![[Grinding Device] Tape Grinding Unit "BM Series"](https://image.mono.ipros.com/public/product/image/31b/2000180536/IPROS76454250891536593949.jpeg?w=280&h=280)
